Yihao PCBA factory planning: the new plant is equipped with central air conditioning, air shower room, anti-static treatment, constant temperature and humidity warehouse, etc.; equipped with new imported Yamaha, Samsung, NXT3, automatic solder paste printer, ten temperature zone reflow Soldering furnace, wave soldering, AOI/SPI/3D XRAY/smart first piece tester, more equipment (read more). . .
| PCBA Capacity | 9.6 million solder joints/day | |
| PCBA Lines | 5 | |
| Rejects Ratio | Resistor & Capacitor: 0.3% | |
| IC：no rejects | ||
| PCB Type | POP/Ordinary/FPC/Flex-rigid/Metal-based | |
| Components Specification | Min. Encapsulation | 03015 Chip/0.35 Pitch BGA |
| Min.Component Accuracy | ±0.04mm | |
| IC Chip Precision | ±0.03mm | |
| PCB Specification | PCB Size | 50*50mm - 774*710mm |
| PCB Thickness | 0.3-6.5mm | |
PCBA Workshop
Parmi 3D SPI, Korea
Samsung PCBA High-speed Patch
YAMAHA PCBA High-speed Patch
Automatic LAser Scanner
3D X-RAY Checking Equipment
Reflow Soldering Machine
Solder Paste 3D SPI Equipment
Holly AOI
ICT Testing
Parmi 3D SPI
SAKI 3D AOI
sinic-Tek SPI
SMT FAI Inspector
X-Ray Inspector
The production line is equipped with high-end equipment, high-precision and high-yield processing.
Carry out quality inspection and control in each processing link to prevent defective products from flowing into the next link.
Set up multiple quality personnel for random inspection throughout the process.
1Glued cardboard: test whether the PCBA placement position is correct, greatly reduce the PCBA trial production time and the waste of components, and effectively ensure the quality of the PCBA
2Intelligent first article detector: detects wrong materials, missing parts, polarity, direction, silk screen, etc., mainly used in the first article detection; compared with manual inspection, the accuracy is higher and the speed is increased by 50%+
3SPI-automatic 3D solder paste thickness gauge: detects various solder paste printing quality problems such as missing print, less tin, more tin, continuous tin, offset, poor shape, board surface contamination, etc.
4AOI: detect various problems after mounting: short circuit, material leakage, polarity, displacement, wrong parts
5Xray: Open and short circuit detection of BGA, QFN and other devices
